Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy
نویسندگان
چکیده
Abstract Wetting phenomena concerning Sn-Zn eutectic alloys with Ag addition were studied in contact Cu substrate at 250 °C and the presence of ALU33 flux. The chosen wetting time was 5 s. Then situ STEM isothermal heating 150 lasting for 10, 40 70 min conducted to establish sequence phase appearance. intermetallic phases within Cu-Zn system identified. formation interface microstructure determined. It is demonstrated that ε-Cu(Ag)Zn 4 appears first it followed by γ-Cu(Ag) Zn 8 . resulting saturated solder transforms into γ taking scallop-like shape.
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ژورنال
عنوان ژورنال: Journal of Materials Engineering and Performance
سال: 2023
ISSN: ['1544-1024', '1059-9495']
DOI: https://doi.org/10.1007/s11665-023-08284-8